Specification
Manufacturer | NXP |
Type of integrated circuit | ARM microcontroller |
SRAM memory capacity | 136kB |
Case | LBGA256 |
Supply voltage | 2.2…3.6V DC |
Mounting | SMD |
Number of inputs/outputs | 164 |
Flash memory capacity | 512kB |
Kind of architecture | Cortex M4/M0 |
Operating temperature | -40…85°C |
Interface
- CAN
- EBI
- EMI
- Ethernet
- I2C
- IrDA
- Microwire
- QEI
- SPI
- SSI
- SSP
- UART
- USART
- USB
- USB OTG
Additional information
- Gross weight: 1 g
- Manufacturer part number: LPC4333FET256,551
Information about the packaging of components
Products that require protection against moisture are packed, together with absorbent and humidity sensor, in hermetically sealed Moisture Barrier Bags (MBB). A label with appropriately marked Moisture Sensitivity Level (MSL) and instructions on humidity sensitive components handling is stuck on the bag. Power LEDs in COB form factor are packed in trays or blisters, which prevent contact between sensitive surface of LED and packaging.
Datasheet: https://www.nxp.com/docs/en/data-sheet/LPC435X_3X_2X_1X.pdf
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